B. Cha, University of Southern California K. Chakrabarty, Duke University T. Chakraborty, Qualcomm

K Chakravadhanula, E Acar, M Agrawal, A Ahmed, B Alizadeh, E Amyeen, D Armstrong, Advantest R Arnold, F Azais, LIRMM K Balanchandran, B Becker, B Benware, P Berndt, Cypress Semiconductor, A Biswas, S Biswas, NVIDIA S Blanton, P Bose, B Brown, Xcerra A Burgmeier, K Butler, J Cadogan, Teradyne Y Cai, J Carulli, M Chandrasekar, K Chandrasekhar, D Chen, L Chen, Oracle W Chen, E Cheng, T Cheng, D Cheng, Xilinx C Cher, CF Chia, C Chiang, V Chikermane, Y Cho, D Corrigan, R Daasch, P Das, S De Carlo, R Desineni, S Deutsch, J Doege, Centtech A Downey, ADAPT D Drmanac, K Dwarakanath, N Fern, G Fey, G Fleeman, B Floyd, T Frank, STMicroelectronics M Fujita, Y Gao, Oracle C Gavin, Xcerra R Geiger, D Gerwitz, A Gharehbaghi, A Ghofrani, G Grimes, G Guglielmo, R Guo, Synopsys S Gupta, S Gurumurthy, AMDN Hakim
2015 IEEE International Test Conference (ITC)
Publication year: 2015
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Abstract

Page 1. INTERNATIONAL TEST CONFERENCE ® 2015 Technical Paper Reviewers J. Abraham, University of Texas at Austin E. Acar, Intel M. Agrawal, Duke University A. Ahmed, Hanyang University R. Aitken, ARM Z. Al-Ars, Delft University of Technology B. Alizadeh, University of Tehran E. Amyeen, Intel D. Armstrong, Advantest R. Arnold, Infineon Technologies F. Azais, LIRMM K. Balanchandran, Cisco Systems M. Barragan, IMAG B. Bartlett, Advantest M. Batek, Broadcom B. Becker, University of Freiburg B. Benware, Mentor Graphics P. Berndt, Cypress Semiconductor A. Biswas, Intel S. Biswas, NVIDIA S. Blanton, Carnegie Mellon University P. Bose, IBM B. Brown, Xcerra A. Burgmeier, Freescale Semiconductor K. Butler, Texas Instruments J. Cadogan, Teradyne Y. Cai, Avago Technologies J. Carulli, GLOBALFOUNDRIES B. Cha, University of Southern California K. Chakrabarty, Duke University …